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Spur Electron's Surface Mount Technology (SMT) facility

The in-line SMT production line enables efficient, precise and controlled manufacturing, ensuring consistent quality throughout the assembly process.

 

The facility includes:

 

• Board stacker
• Solder paste printer
• Automated placement machine
• Vapour phase reflow (VP Reflow)
• Automated optical inspection (AOI)
• Board un-loader

 

All processes are carried out under ESA-qualified standards, supported by highly experienced ESA and IPC certified technicians and inspectors, ensuring reliable assembly for demanding and mission-critical environments.

Spur Electron's Surface Mount Technology (SMT) facility
Spur Electron's Surface Mount Technology (SMT) facility

Surface Mount Technology Facility

Spur Electron’s Surface Mount Technology (SMT) facility supports the precision assembly of complex electronic circuits used in high-reliability applications, including space and defence systems. Using advanced automated equipment combined with expert technical oversight, the facility ensures consistent manufacturing standards and dependable component placement.

The in-line SMT production process allows components to be accurately placed, soldered and inspected while maintaining strict quality control throughout the build cycle.

The SMT line includes:

• Board stacker
• Solder paste printer
• Automated placement machine
• Vapour phase reflow (VP Reflow)
• Automated optical inspection (AOI)
• Board un-loader

All processes are carried out under ESA-qualified procedures, with assembly and inspection performed by experienced ESA and IPC certified technicians, ensuring reliability for demanding and mission-critical environments.

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