Semi-Auto Assembly & Testing

The semi-auto assembly and test facility is housed in a purpose built area adjacent to our cleanroom and manufacturing area. Using this new facility we are now able to offer a faster, higher volume, surface mount placement and service.

The assembly line comprises of:

Programmable Dot Placer

A computerised dispensing system which applies an exact amount of solder paste to the bare printed circuit boards eliminating the need for stencils. It can place 10,000 dots/hour, has automatic optimisation and an aligning camera with monitor, for accurate dot placement. Modifications to layouts can be added in seconds.

Pick & Place Machines

These enable the operator to place the components onto the solder paste as well as dispense paste and perform hot air soldering if required. The guiding system allows exact positioning of the pick and place head. The components are either kitted into a conductive carousel or can be dispensed from tape and/or stick feeders.

Vapour Phase Re-Flow

This solders the components onto the assembled boards and is a closed loop, environmentally friendly re-flow machine. It is not possible to over-heat the boards, soldering takes place in an oxygen free environment and uses a fluid that is non-toxic and environmentally compatible. Up to four thermocouples placed on the board allow extremely accurate temperature profiles to be produced.

Flying Probe Testing.

Component signatures are analysed on un-powered boards, the test method is non-destructive; it will not damage the components under test or any other component within the circuit. It is able to detect leakage and bonding problems as well as component shorts, opens, incorrect polarity and wrong values.