LAB Services

The accurate laboratory analysis of electronic components for long life, high reliability applications, requires a combination of skill, knowledge and facilities all of which are available in abundance within Spur Laboratory Services.

Our laboratory staff combine expert component processing and technology knowledge with specialist equipment skills to offer our customers a wide range of component assessment services.

Laboratory Services

• Destructive Physical Analysis
• Constructional Analysis
• Failure Analysis
• PIND Testing
• Fine & Gross Leak Testing
• SEM Inspection
• Pre Encapsulation Inspection
• Final Source Inspection
• Wafer Lot Acceptance
• Plastic Encapsulated Microelectronics
• De-processing
• Non-Destructive testing
• X-Ray Inspection

Our equipment includes:

• Scanning Electron Microscope
• Materials Analysis (EDX)
• PC driven image capture and archive system
• Fine & Gross Leak detectors
• PIND Test
• Automatic Microsectional Equipment
• Electrical Test Equipment
• X-Ray (100kV)

Destructive Physical Analysis (DPA)

DPA is carried out to meet ESA, NASA, MIL Specifications, Spur internal or customer specific standards, on all Electrical, Electro-mechanical and Electronic components where DPA is identified as a requirement.

All results, conclusions and recommendations are presented in a Spur standard format report or as requested by the customer. These reports can be supplied as a hard copy or in a fully electronic PDF format on CD ROM.

Electrical Test Support

• V-I Curve Tracing
• DC and Functional Testing
• AC Parametric Testing

EDX Analysis

• Identification and Quantification of materials
• Contamination Analysis

Radiographic Inspection

• Real Time X-rays (100kV)
• BGA and CGA Analysis

Image Archive System

Allows storage of numerous pictures of each stage of analysis, creating a complex library of detailed images which can be referred to at a later date if required.

Plastic Encapsulated Microelectronics

With the continued trend towards Components Off The Shelf (COTS) and Plastic Encapsulated Microelectronics (PEM’s), we have increased our assessment capability to include the deprocessing of plastic encapsulated components.

Customer Specific Reports

• Quick turnaround Summaries
• Customise screening flows
• End-User Defined format